Strip Warpage Behavior and Mechanism in Single Roll Driven Rolling
نویسندگان
چکیده
منابع مشابه
Prediction of Work Roll Initial Crown according to Desired Strip Profile in Hot Rolling
The final hot strip profile is a superposition of the roll initial crown, the roll bending and flattening crown, the roll wearing crown and the roll thermal crown. In this research, linear regression models are proposed to predict the roll force, the roll wearing crown and the roll thermal crown using experimental data provided by Mobarake Steel Complex (MSC). The short beam theory based on ela...
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Strip profile control in cold rolling of thin strip is a difficult and challenge problem found in industry. Currently using the novel type of strip rolling mill, such as the work roll crossing and shifting is the one of the main methods to control the strip profile quality in cold rolling. In this paper, 3-D finite element simulation models of the thin strip profile in cold rolling for the work...
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The final hot strip profile is a superposition of the roll initial crown, the roll bending and flattening crown, the roll wearing crown and the roll thermal crown. In this research, linear regression models are proposed to predict the roll force, the roll wearing crown and the roll thermal crown using experimental data provided by Mobarake Steel Complex (MSC). The Euler-Bernoulli beam theory ba...
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The finishing train of a hot strip mill has been modelled by using a constant volume element model. The accuracy of the model has been increased by using an Artificial Neural Network (ANN). A non-linear Rank Based Genetic Algorithm has been developed for the optimization of the work roll profiles in the finishing stands of the simulated hot strip mill. It has been compared with eight other expe...
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Warpage is known to be one of the primary molding issues during assembly of QFN package. It affects the package sawing process, and cause reliability issues. The main cause of warpage of area array packages is the coefficient thermal expansion (CTE) mismatch between the moulding compound and other components inside the package. The objective of this study is to investigate the warpage induced o...
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ژورنال
عنوان ژورنال: Tetsu-to-Hagane
سال: 2015
ISSN: 0021-1575,1883-2954
DOI: 10.2355/tetsutohagane.101.319